Offering Low-to-high volume solutions for prototypes and LRIPs to high volume productions exceeding 10 million components a month. Lot acceptance testing per MIL-STD-883/750, device characterization, screening, binning, S-parameters to 67 GHz, environmentals and accelerated life -80C to +200C.
DESIGNLow cost form, fit, function solutions with value-added customization options for improved performance and packaging and full quick turnkey solutions, from IC design-to-packaged product and qualifications optional.
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ASSEMBLYAssembly to MIL-PRF-38535 and MIL-STD-883 in JEDEC case outlines or customized packages per specifications. Small lot and full production runs done in-house with verifiable QMS and process controls. High-reliability assemlby, hermetic and non-hermetic. Bond pull, leak tests, x-ray, die shear.
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MIL-STD-883 process flows, environmental, mechanical and group A-D testing and electrical testing. JEDEC screening to JESD22. Compliant test methods per MIL-STD-883 and MIL-PRF-38535. RF testing and characterization on wafer or die level, S parameters with current 67GHz in-house. Static and dynamic burn-in services, both MIL-STD and customized.
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QUALITYHorizon maintains high quality protocols and in-house procedures to guarantee product Quality is integral in providing high reliability products in demanding environments and critical conditions. Operation in a class 1000 cleanroom with class 100 hoods, per ISO14644 and class 0 ESD stations.
Die banking services available. |
DATASHEET & CHARACTERIZATIONDevice characterization, datasheet generation, analytics, custom software solutions for test.
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